Seboka sa Flex PCB

Tlhaloso e Khutšoanyane:


  • Boitsebiso:Katpon kapa Equivalents
  • Qetella:ENIG (Ni: 2-6um; Au: 0.03-0.10um)
  • Lesela la Koporo:1/3OZ, 1/2OZ, 1OZ, 2OZ
  • Polyimide:0.5mil, 1mil.2mil (e ntšo, e tšoeu, Amber)
  • Min.Mola/Sebaka:0.06mm/0.07mm
  • Mamello ea Impedans (haeba ho hlokahala):±10%
  • Min.Mokoti oa ho phunya:+/- 0.10MM
  • Mamello ea PTH:+/- 0.075mm
  • Silkscreen:Bosoeu kapa Botsho (TBD)
  • Mamello ea setšoantšo:+/-0.10MM kapa 0.05MM
  • Ho tsamaisa ka sekepe:ka array kapa Ka likotoana tse ikemetseng
  • Lintlha tsa Sehlahisoa

    Tšehetso ea moralo

    HMLV, tšebeletso ea ho Fetola kapele

    Litharollo tsa ho Romela

    Li-tag tsa Sehlahisoa

    Re ka fana ka tšebeletso ea kopano ea PCB e feto-fetohang, ho kenyelletsa le thomello ea likarolo moo u fanang ka lisebelisoa, hammoho le tšehetso ea turnkey moo re sebetsanang le likarolo tsohle tsa ts'ebetso ea kopano.Hore na o hloka hore re sebelise likarolo tseo u fanang ka tsona kapa ho hlokomela tšebetso eohle ea kopano, re na le bokhoni ba ho fihlela litlhoko tsa hau.Sepheo sa rona ke ho netefatsa ts'ebetso ea kopano e sa reroang, e sebetsang hantle e fihlelang litlhoko tsa hau tse ikhethileng.Ho tloha botong e se nang letho ho isa kopanong, re hlokomela merero ea hau.

     

    Tlhokomeliso: Bakeng sa kopano ea PCB e tenyetsehang, ho baka pele hoa hlokahala.Mokhoa oa pele oa ho baka o thusa ho tlosa mongobo leha e le ofe o ka 'nang oa e-ba teng ka thepa e kang lipotoloho tse feto-fetohang le likarolo pele mokhoa oa sebele oa soldering o etsahala.Sena se bohlokoa ho thibela mathata a kang delamination kapa solder joint defects nakong ea kopano.Ka ho baka thepa esale pele, o netefatsa boleng ba kakaretso bo betere le ho ts'epahala ha kopano ea hau ea PCB e tenyetsehang.




  • E fetileng:
  • E 'ngoe:

  • Ho latela IPC 6013, mofuta oa Boto ho kenyelletsa
    Mofuta oa 1 oa Maboto a Hatisitsoeng a Lehlakore le le Leng
    Mofuta oa 2 oa Maboto a Hatisitsoeng a Mahlakore a Habeli a Flexible
    Type 3 Multilayer Flexible Printed Boards
    Mofuta oa 4 Multilayer Rigidi le Flexible Material Combinations

    Nakong ea pejana, ts'ehetso ea tekheniki ke ea bohlokoa ho uena ho tsoela pele ka meralo, ho tloha ho bophara ba mela / sebaka ho ea ho stackup (khetho ea thepa), haholo-holo bakeng sa lipalo tsa boleng ba taolo ea impedance, Ka kopo, ikutloe u lokolohile ho ikopanya le rona bakeng sa lipotso leha e le life.

    Bolion e khothaletsa hore merero eohle e mecha e be le netefatso ea li-prototypes pele ho tlhahiso ea bongata.Prototype ke ea bohlokoa bakeng sa tlhahlobo ea theknoloji, ha ho le joalo, ho ka ba molemo ho fumana theko ea tlholisano ka ho fetisisa bakeng sa tlhahiso ea bongata le nako ea ho etella pele e utloahalang.

    Ho tloha prototype ea Quick-Turn ho isa tlhahiso ea letoto, re etsa sohle se matleng a rona ho fihlela tlhoko ea nako ea bareki.

    Tlhaloso Mohlala oa FPC
    (≤1m²
    FPC Standard Turn
    (≥10m²
    Kopano ea SMT
    FPC ea lehlakore le le leng Matsatsi a 2-4 Matsatsi a 6-7 Matsatsi a 2-3
    FPC e Mahlakore Habeli 3-5 matsatsi Matsatsi a 7-9 Matsatsi a 2-3
    Multilayer/Airgap FPC Matsatsi a 4-6 8-10 matsatsi Matsatsi a 2-3
    Rigid-Flex Board Matsatsi a 5-8 Matsatsi a 10-12 Matsatsi a 2-3
    * Matsatsi a ho sebetsa

    Ho latela litaelo tsa hau tsa ho romella haeba ho na le, haeba ho se joalo, re tla lumellana le lipehelo tsa tlholisano ea thomello, FedEx, UPS, DHL.Xiamen Bolion o na le boiphihlelo ka litokomane tsohle tsa litloaelo.

    Ngola molaetsa wa hao mona mme o re romele wona