Boto ea Potoloho ea PWB ea lehlakore le le leng bakeng sa Likoloi tsa Elektronike

Tlhaloso e Khutšoanyane:


  • Boitsebiso:Katpon kapa Equivalents
  • Qetella:ENIG (Ni: 2-6um; Au: 0.03-0.10um)
  • Lesela la Koporo:1/3OZ, 1/2OZ, 1OZ, 2OZ
  • Polyimide:0.5mil, 1mil.2mil (e ntšo, e tšoeu, Amber)
  • Min.Mola/Sebaka:0.06mm/0.07mm
  • Mamello ea Impedans (haeba ho hlokahala):±10%
  • Min.Mokoti oa ho phunya:+/- 0.10MM
  • Mamello ea PTH:+/- 0.075mm
  • Silkscreen:Bosoeu kapa Botsho (TBD)
  • Mamello ea setšoantšo:+/-0.10MM kapa 0.05MM
  • Ho tsamaisa ka sekepe:ka array kapa Ka likotoana tse ikemetseng
  • Lintlha tsa Sehlahisoa

    Tšehetso ea moralo

    HMLV, tšebeletso ea ho Fetola kapele

    Litharollo tsa ho Romela

    Li-tag tsa Sehlahisoa

    Boto ea Potoloho ea PWB e lehlakoreng le le leng bakeng sa Elektronike ea Likoloi, e nang le IATF16949, PPAP Level 3 e fumaneha.

    Boto ea potoloho e hatisitsoeng ka mahlakoreng a le mong (FPCB) ke mokhoa oa ho hokahanya oa elektronike o entsoeng ka substrate e tšesaane e tsitsitseng e nang le mokhoa oa conductive ka lehlakoreng le leng.Hangata e sebelisoa lits'ebetsong moo ho nahanoang ka sebaka le boima ba 'mele, joalo ka lisebelisoa tse nyane tsa elektroniki tsa bareki, lisebelisoa tsa bongaka le lisebelisoa tsa likoloi.Li-FPCB li fana ka ho tenyetseha le ho ts'epahala, ho li etsa hore li tšoanelehe bakeng sa lits'ebetso moo liboto tsa potoloho tse thata li kanna tsa se sebetse.Hangata li sebelisoa lisebelisoa tse hlokang ho sisinyeha kapa ho inama, joalo ka lik'hamera, lilaptop, le theknoloji e ka roaloang.




  • E fetileng:
  • E 'ngoe:

  • Ho latela IPC 6013, mofuta oa Boto ho kenyelletsa
    Mofuta oa 1 oa Maboto a Hatisitsoeng a Lehlakore le le Leng
    Mofuta oa 2 oa Maboto a Hatisitsoeng a Mahlakore a Habeli a Flexible
    Type 3 Multilayer Flexible Printed Boards
    Mofuta oa 4 Multilayer Rigidi le Flexible Material Combinations

    Nakong ea pejana, ts'ehetso ea tekheniki ke ea bohlokoa ho uena ho tsoela pele ka meralo, ho tloha ho bophara ba mela / sebaka ho ea ho stackup (khetho ea thepa), haholo-holo bakeng sa lipalo tsa boleng ba taolo ea impedance, Ka kopo, ikutloe u lokolohile ho ikopanya le rona bakeng sa lipotso leha e le life.

    Bolion e khothaletsa hore merero eohle e mecha e be le netefatso ea li-prototypes pele ho tlhahiso ea bongata.Prototype ke ea bohlokoa bakeng sa tlhahlobo ea theknoloji, ha ho le joalo, ho ka ba molemo ho fumana theko ea tlholisano ka ho fetisisa bakeng sa tlhahiso ea bongata le nako ea ho etella pele e utloahalang.

    Ho tloha prototype ea Quick-Turn ho isa tlhahiso ea letoto, re etsa sohle se matleng a rona ho fihlela tlhoko ea nako ea bareki.

    Tlhaloso Mohlala oa FPC
    (≤1m²
    FPC Standard Turn
    (≥10m²
    Kopano ea SMT
    FPC ea lehlakore le le leng Matsatsi a 2-4 Matsatsi a 6-7 Matsatsi a 2-3
    FPC e Mahlakore Habeli 3-5 matsatsi Matsatsi a 7-9 Matsatsi a 2-3
    Multilayer/Airgap FPC Matsatsi a 4-6 8-10 matsatsi Matsatsi a 2-3
    Rigid-Flex Board Matsatsi a 5-8 Matsatsi a 10-12 Matsatsi a 2-3
    * Matsatsi a ho sebetsa

    Ho latela litaelo tsa hau tsa ho romella haeba ho na le, haeba ho se joalo, re tla lumellana le lipehelo tsa tlholisano ea thomello, FedEx, UPS, DHL.Xiamen Bolion o na le boiphihlelo ka litokomane tsohle tsa litloaelo.

    Ngola molaetsa wa hao mona mme o re romele wona

    Lihlopha tsa lihlahisoa