Inkcazo | Umgangatho | Ekhethekileyo |
Min.Umgca | .07mm | .05mm |
Min.Izithuba | .07mm | .05mm |
Min.Ubungakanani bomngxuma | φ 0.15mm | φ 0.1mm |
Ukunyamezelana | +/- 0.1mm | +/-0.05mm |
Ubungakanani bephaneli | 250mm X 340mm | 550mm X 630mm* Ubukhulu.ubude ukuya kwi-30meters |
Ulawulo lwe-Impedans | +/- 10% | |
Max Layer Ukukwazi | Iileya ezili-12 | |
Umgangatho wento | 2:1 (umzuzu φ0.1mm) | |
5:1 (umzuzu φ0.2mm) | ||
8:1 (umzuzu φ0.3mm) | ||
IMveliso yeNyanga | 400,000 sq.ft./40,000 m² |
Izinto eziphathekayo | |
Ifilimu esisiseko | Polyimide (0.5mil, 1mil, 2mil) Polyester (0.5mil, 1mil) |
Umbandela Wokuqhuba | I-Copper Foil ( 1/3oz, 1/2oz, 1oz, 2oz, Mix 7oz) |
Constantan | |
Ikhoneli 600 | |
I-Ink ye-Sliver | |
I-Ink yeCarbon | |
Ukuncamathelisa | I-epoxy, i-Acrylic, i-Adhesiveness |
Izinto zokugquma | Polyimide (0.5mil, 1mil, 2mil) (Mthubi, Mhlophe, Mnyama) |
Ipolyester (1 mil , 2 mil) | |
Imaski eSolder (Green, Yellow, Black…) | |
PSA | 3M467, 3M468, 3M9077, TESA8853…… |
Stiffener | PI, FR4, PET, Steel, Aluminiyam... |
Unyango loMphezulu | Ukutyeba |
Gold Plating | Ni:3-9um;Au: 0.03-0.09um |
ENIG | Ni:3-9um;Au: 0.03-0.09um |
I-Hard Gold Plating | Ni:3-9um;Au:0.1-0.3um |
Ukufakwa kweTin | Sn: 3-7um |
Ukuntywiliselwa kwiTin | Ewe |
OSP | Ewe |