China Low MOQ for Flex Circuits Assembly - 4 Layers Rigid-Flex PCB with Green L.P.I Soldermask – Bolion Manufacturer and Supplier

Low MOQ for Flex Circuits Assembly - 4 Layers Rigid-Flex PCB with Green L.P.I Soldermask – Bolion

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We thinks what customers think, the urgency of urgency to act in the interests of a customer position of principle, allowing for better quality, lower processing costs, prices are more reasonable, won the new and old customers the support and affirmation for Pcb Vendors, Automotive Circuit Board, Rigid Flex Circuit Board, Welcome around the world consumers to speak to us for organization and long-term cooperation. We'll be your reputable partner and supplier of auto areas and accessories in China.

Low MOQ for Flex Circuits Assembly - 4 Layers Rigid-Flex PCB with Green L.P.I Soldermask – Bolion Detail:

According to IPC-2223B, Type 4 Multilayer rigid and flexible material combinations containing three or more conductive layerswith plated-through holes, flex substract with or without adhesive.

Rigid-Flex PCB for industrial application, Xiamen Bolion support from 2 layer Rigid-Flex PCB to 12 layers, please feel free to send us the gerber file or ODB++ to evaluation.

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"Sincerity, Innovation, Rigorousness, and Efficiency" would be the persistent conception of our enterprise with the long-term to build with each other with consumers for mutual reciprocity and mutual advantage for Low MOQ for Flex Circuits Assembly - 4 Layers Rigid-Flex PCB with Green L.P.I Soldermask – Bolion , The product will supply to all over the world, such as: Zambia, United Arab emirates, Brazil, Due to our strict pursues in quality, and after-sale service, our product gets more and more popular around the world. Many clients came to visit our factory and place orders. And there are also many foreign friends who came for sight seeing, or entrust us to buy other stuff for them. You are most welcome to come to China, to our city and to our factory!

According to IPC 6013, Board type including
Type 1 Single-Sided Flexible Printed Boards
Type 2 Double-Sided Flexible Printed Boards
Type 3 Multilayer Flexible Printed Boards
Type 4 Multilayer Rigidi and Flexible Material Combinations

At earlier stage, technical support is important for you to proceed the designs, from line width/spacing to stackup (material selection), especially for impedance control value calculation, Please feel free to contact us for any questions.

Bolion recommend that all new projects should have prototypes confirmation before mass production. Prototype is important for technology review, meanwhile, it would be helpful to get the most competitive price for mass production and resonable lead time.

From Quick-Turn prototype to series production, we are doing our best to meet customers’ lead time requirement.

Description	FPC Prototype （≤1m²）	FPC Standard Turn （≥10m²）	SMT Assembly
Single-sided FPC	2-4 days	6-7 days	2-3 days
Double-Sided FPC	3-5 days	7-9 days	2-3 days
Multilayer/Airgap FPC	4-6 days	8-10 days	2-3 days
Rigid-Flex Board	5-8 days	10-12 days	2-3 days
		* Working Days

Following your shipping instruction if there is any, if not, we will accordinate with the most competitive shipping terms, FedEx, UPS, DHL. Xiamen Bolion is experienced with all the paperwork for customs.

2 Layer Circuit Board