Tsanangudzo	Standard	Special
Min.Mutsara	.07mm	.05mm
Min.Spacing	.07mm	.05mm
Min.Hole Saizi	φ 0.15mm	φ 0.1mm
Rondedzera kushivirira	+/- 0.1mm	+/-0.05mm
Panel Size	250mm X 340mm	550mm X 630mm*Max.kureba kusvika 30metres
Impedans Control	+/- 10%
Max Layer Kugona	12 layers
Aspect ratio	2:1 (min φ0.1mm)
	5:1 (min φ0.2mm)
	8:1 (min φ0.3mm)
Monthly Production	400,000 sq. ft. / 40,000 m²

 

Material
Base film	Polyimide (0.5mil, 1mil, 2mil) Polyester (0.5mil, 1mil)
Conductive Material	Copper Foil ( 1/3oz, 1/2oz, 1oz, 2oz, Sanganisa 7oz)
	Constantan
	Inconel 600
	Sliver Ink
	Carbon Ink
Adhesive	Epoxy, Acrylic, Adhesiveness
Insulating Material	Polyimide (0.5mil, 1mil, 2mil) (Yero, Ichena, Nhema)
	Polyester (1 mirita, 2 miriyoni)
	Solder Mask (Green, Yero, Dema…)
PSA	3M467, 3M468, 3M9077, TESA8853……
Stiffener	PI, FR4, PET, Simbi, Aluminium…

 

Surface Treatment	Ukobvu
Gold Plating	Ni:3-9um;Au: 0.03-0.09um
ENIG	Ni:3-9um;Au: 0.03-0.09um
Hard Gold Plating	Ni:3-9um;Au:0.1-0.3um
Tin Plating	Sn: 3-7um
Kunyudza Tin	Ehe
OSP	Ehe