ʻO kā mākou huahana

ʻO ka maikaʻi Platinum ke alakaʻi nei i ka honua

Me kahi kokoke i 20 mau makahiki o ka ʻike i ka ʻoihana uila, ua loea ʻo Xiamen Bolion i ka hana ʻana i ka Flex Circuitry e pili ana i ka FPC ʻaoʻao hoʻokahi, ʻelua ʻaoʻao FPC, Dual Access FPC, Kapton Heater, Rigid-Flex PCB no ka Lapaʻau a me Biotech, Automotive, Aerospace a me Defence, Consumer, IOT and Wearable Device, industrial, etc., Multilayer PCB a hiki i 12 papa, hiki ke kākoʻo ʻia ka hui uila ma ka hale.
Hoʻokaʻaʻike i kahi loea

  • Welina mai e kipa iā Bolion Tech.

E pili ana iā mākou

Xiamen Bolion Tech.Ua hoʻokumu ʻia ʻo Co., Ltd. ma Jan. 23, 2003 me 30,000 sq. m o kahi mea kanu maʻemaʻe a me nā mea hana FPC kiʻekiʻe loa a me nā mea hoʻāʻo.ʻO kā mākou mau mahina he 40,000sq.m o ke kūlana kiʻekiʻe Hoʻokahi ʻaoʻao, ʻelua ʻaoʻao, ʻelua-ʻaoʻao, Multilayer, Air-gap FPCs, Rigid-Flex PCBs a me ka hui ʻana, i hoʻohana nui ʻia i ka automotive, pā uila, nā lāʻau lapaʻau, ka mana ʻoihana, aerospace, a me nā ʻoihana uila uila.

ʻO kā mākou pono

He aha ka mea e kū ai mākou i ka ʻoihana PCB?

ʻO ka maikaʻi Platinum Ke alakaʻi nei i ka honua.
Hoʻopaʻa mākou e hoʻolako i ka huahana a me ka lawelawe maikaʻi no nā mea kūʻai aku i mahalo ʻia

Pōmaikaʻi

ʻO kā mākou pono

Mana R&D ikaika

ʻO ka ʻaina ahiahi ka lōʻihi a me ka nui FPC: Ka lōʻihi a hiki i 30m
FPC paʻakikī a kūikawā: Papa pale pahu pahu, Multilayer me ka airgap FPC a hiki i ka 12 papa Rigid-Flex PCB.
FPC Patents: 66 pau loa.

ʻenehana kumu

ʻO kā mākou pono

Me nā pilina he ʻumi makahiki

Hana pū mākou me kā mākou mea hoʻolako maka.

Hui Hoa

ʻO kā mākou pono

Ma ka Hoʻouna Manawa

Kākoʻo i ka Hight Mix Low Value Flex a me Rigid-Flex PCB koi.

Kaʻina hana hale piha

ʻO kā mākou pono

Hui SMT

Mai ka hoʻolālā FPC a hiki i ka Pilot Run, hana nui, Assembly, Test, kākoʻo mākou i ka Turn-Key a me ka papahana consignement.

Ahahui