Lihlahisoa tsa rona

Boleng ba Platinum bo khanna lefatše

Ka boiphihlelo ba lilemo tse ka bang 20 indastering ea elektroniki, Xiamen Bolion e khethehile ho hlahiseng Flex Circuitry e kenyeletsang FPC e nang le 'ngoe, Doule-Sided FPC, Dual Access FPC, Kapton Heater, PCB e Flex bakeng sa Bongaka le Biotech, Likoloi, Aerospace le Ts'ireletso, Moreki, IOT le Sesebelisoa se ka Aparang, indasteri, jj, Multilayer PCB ho fihlela mekhahlelo e 12, kopano ea Elektroniki le eona e ka ba ts'ehetso ka tlung.
Ikopanye le Setsebi

  • Welcome to visit Bolion Tech.

Mabapi le rona

Xiamen Bolion Tech. Co, Ltd. e thehiloe ka Pherekhong 23, 2003 e nang le 30,000 sq. M ea sebaka se hloekileng sa semela le lisebelisoa tse tsoetseng pele haholo tsa tlhahiso ea FPC le lisebelisoa tsa liteko. Bokgoni ba rona ba khoeli le khoeli ke 40,000sq. limithara tsa boleng bo phahameng ba mahlakore a mabeli, mahlakore a mabeli, phihlello ea bobeli, Multilayer, Air-gap FPCs le li-PCB tse thata, tse sebelisoang haholo sebakeng sa lifofane, likoloi, lisebelisoa tsa bongaka, taolo ea indasteri le indasteri ea lisebelisoa tsa elektroniki tsa bareki.

Molemo oa rona

Ke eng e etsang hore re ikhethang ka liindasteri PCB?

Boleng ba Platinamo Ho tsamaisa lefatše. Boleng bo lula bo beoa sebakeng sa pele.

Molemo

Molemo oa rona

Matla a R&D

Lijo tsa mantsiboea tse telele le tse kholo FPC: Bolelele bo fihlang ho 30m
Complex le FPC e khethehileng: Battery board pack board, Multilayer e nang le kapa e se nang airgap FPC Ho fihlela ho 12 layer PCB-Flex PCB.
Patent ea FPC: 66 ka botlalo.

Theknoloji ea Core

Molemo oa rona

Le likamano tse leshome

Re sebetsa 'moho le barekisi ba lihlahisoa tsa rona tse tala.

Ts'ebelisano 'moho

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Ka Nako ea Phethahatso

Ts'ehetsa Hight Mix Low Value Flex le Flexig ea Flex PCB.

Ts'ebetso ea ntlo e felletseng

Molemo oa rona

Kopano ea SMT

Ho tloha moralo oa FPC ho Pilot Run, tlhahiso ea bongata, Kopano, Teko, re ts'ehetsa projeke ea Turn-Key le projeke ea thepa.

Assembly