NIPA RE

Xiamen Bolion Tech. Co., Ltd. a ti iṣeto ni Jan. 23, 2003 pẹlu 30,000 sq. M ti o mọ ọgbin agbegbe ati awọn julọ to ti ni ilọsiwaju FPC ẹrọ itanna ati igbeyewo ohun èlò. Wa oṣooṣu agbara ni 40,000sq. m ti ga-didara Single-apa, Double-apa, Meji-wiwọle, Multilayer, Air-aafo FPCs ati kosemi-Flex PCBs, eyi ti o ti wa ni o gbajumo ni lilo ninu awọn Ofurufu, Oko, awọn ẹrọ egbogi, ise Iṣakoso, ati awọn olumulo Electronics ise.

  • 16 niwon THE
    odun OF 2003
  • 400 No.OF
    abáni
  • 50,000 Factory Ilé
  • 40000 / osù gbe agbara
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  • Bolion elo

    Words le nikan so fun o ki Elo. Ṣayẹwo jade yi gallery ti awọn fọto lati ri rẹ Haas lati gbogbo igun.

Bolion Capability

Lati awọn ile ise ká julọ awọn olumulo ore-Iṣakoso, to wa aseyori Alailowaya Ogbon probing System (WIPS), to wa jakejado asayan ti spindles ati tool onipaṣipàrọ, a jẹ ki o tunto rẹ ẹrọ ki o ṣiṣẹ fun o. Lẹhin ti gbogbo, o mọ ohun ti o nilo dara ju ẹnikẹni. Mọ diẹ ẹ sii nipa ohun gbogbo Haas ni lati pese.

Ṣe ara rẹ PCB